iMetal-40UP Metallographic Microscope

Product Features

• Equipped with an infinite-distance chromatic aberra- tion correction system and a semi-reversed objective lens, combined with multiple observation modes and a high-resolution camera, the imaging is clear and sharp, with both details and contrast.
• The differential interference function can convert minute height differences into three-dimensional relief images, accurately detecting hidden defects such as LCD conductive particles and wafer scratches.
• The Mikrosize software supports automatic measure- ment, image stitching and report generation. The du- al-control design of the electric objective lens turnta- ble enhances the detection efficiency.
• The ergonomic frame is equipped with a wide-voltage system, a 4-inch loading platform and a long-work- ing-distance objective lens, which is suitable for vari- ous industrial samples and environments.
• The objective lens, camera pixels, observation tube, etc. can be selected as needed. It supports post-pro- cessing function upgrades to meet the customized re- quirements in various fields such as semiconductors and materials.

Product Applications

• Observation of dislocation pits and step flow defects on the external extension film, identi- fication of nanoscale undulations using DIC technology, which helps improve yield.
• Inspect the sharp edges and burrs of the cut, as well as surface scratches, analyze the voids in the packaging material, and ensure the performance and lifespan of the chip.
• Adapted for MLCC slice detection, it enables observation of the distribution of the elec- trode layer and the interface with the dielectric, and helps identify potential short-circuit hazards.
• Perform microscopic observation on the circuit board slices to evaluate the quality of the solder joints and the defects of the substrate materials.
• Observe the grains and grain boundaries of materials such as metals and ceramics, evalu- ate the heat treatment effect, and provide a basis for material optimization.