Cut-off Wheel

切割片
切割片金刚石
切割片CBN
1 2
切割片

切割片

切割片金刚石

切割片金刚石

切割片CBN

切割片CBN

1 2

1 2

Технические характеристики

AO60 Cut Off Wheels

Application: For cutting extremely hard ferrous metals(HRC>50), like special ductile cast iron, bearing steel, alloy structural steel, high-speed steel, high vanadium high-speed steel, stainless steel, alloy steel, carbon steel, and high hardness easy sintering workpiece.
Technical specification:
Color: Brownish Red   Hardness: Soft
Consumption speed: Fast
Material: Aluminum Oxide  Bond: Resin
Specification(mm)(Diameter*Thickness*Arbor): 152×0.6×12.7, 200×1.0×32, 230×1.2×32, 250×1.5×32, 250×2.0×32, 300×1.5×32, 300×2.0×32, 350×2.5×32, 400×3.0×32, 450×3.5×32
Package: 10PCS

AO50 Cut Off Wheels

Application: For cutting Medium hard ferrous metals(HRC 38~50), like ductile cast iron, malleable cast iron, high phosphorus cast iron, alloy cast iron, bronze and unhardened steel, etc.
Technical specification:
Color: Brownish Red   Hardness: Medium
Consumption speed: Medium
Material: Aluminum Oxide  Bond: Resin
Specification(mm)(Diameter*Thickness*Arbor): 152×0.6×12.7, 200×1.0×32, 230×1.2×32, 250×1.5×32, 250×2.0×32, 300×1.5×32, 300×2.0×32, 350×2.5×32, 400×3.0×32, 450×3.5×32
Package: 10PCS

AO30 Cut Off Wheels

Application: For cutting soft ferrous metals(HRC<38), like soft metal parts copper, aluminum and alloy.
Technical specification:
Color: Brownish Red   Hardness: Hard
Consumption speed: Slow
Material: Aluminum Oxide  Bond: Resin
Specification(mm)(Diameter*Thickness*Arbor): 152×0.6×12.7, 200×1.0×32, 230×1.2×32, 250×1.5×32, 250×2.0×32, 300×1.5×32, 300×2.0×32, 350×2.5×32, 400×3.0×32, 450×3.5×32
Package: 10PCS

DM Diamond Wafering

Application: For very hard or brittle materials, glass ceramics, stone. This series of cutting precision is relatively high, diamond cutting blades can cut ultra-hard materials such as cemented carbide, ceramics and so on.
Features: The saw blade is made of edge sintering technology, with high accuracy and long blade life.
Technical specification:
Blade Material: Diamond Particle
Bond: Stainless Steel
Specification(mm)(Diameter*Thickness*Arbor): 100×0.3×12.7, 125×0.4×12.7, 150×0.5×12.7, 175×0.7×12.7, 200×0.9×22, 200×0.9×32, 254×0.9×32, 300×1.5×32, 350×2.0×32
Package: 10PCS

CBN Wafering Blades

Application: Used for cutting samples of extremely hard metals and hard alloys, non-metallic minerals, glass, ceramics, brittle and brittle materials, etc.
Features: The saw blade is made of edge sintering technology, with high accuracy and long blade life.
Technical specification:
Blades Material: CBN
Bond: Stainless Steel
Specification(mm)(Diameter*Thickness*Arbor): 100×0.3×12.7, 125×0.4×12.7, 150×0.5×12.7, 175×0.7×12.7, 200×0.9×22, 200×0.9×32, 254×0.9×32, 300×1.5×32, 350×2.0×32
Package: 10PCS
 

Recommend of Cut Off Wheels

Choosing the right cut off wheels can ensure the quality of sampling reduce time and cost, find the sample of the Y-axis, and choose the Wheels. When the hardness value is unknown, you can select the cutting blade according to the material description on the left in the table below.

Non-Ferrous Metals                             AO30 Cut Off Wheels
Stainless Steel                             AO50 Cut Off Wheels
Soft Ferrous metals                             AO60 Cut Off Wheels
Ductile Cast Iron                             DM Diamond Wafering
Malleable Cast Iron                             CBN Wafering Blades
Alloy Cast Iron                              
Bronze                              
Tungsten Carbide Steels                              
Hardened steel                              
Carburised steel                              
Hard Ferrous metals                              
High hardness steel                              
Ceramics                              
Silicon carbide glass                              
Brittle materials                              
Non-metallic Minerals                              
Sintered materials                              
    15   25   35   45   55       HRC
 

Guidelines for Wafering Cutting Various Materials

Most wafer cutting is done at speeds between 50 rpm and 5000 rpm with loads varying from 10-1000 grams.Generally, harder specimens are cut at higher loads and speeds (e.g, ceramics and minerals) and more brittle specimens are cut at lower loads and speeds (e.g, electronic silicon substrates). It is interesting to note that the cutting efficiency for sectioning hard/tough ceramics improves at higher speeds and higher loads.
Item Characteristic Speed (rpm) Load (grams)
Silicon Substrate Soft / Brittle <300 <100
Gallium Arsenide Soft /Brittle <200 <100
Bogon Composites Very Brittle 500 250
Ceramic Fiber Composites Very Brittle 1000 500
Glasses Brittle 1000 500
Minerals Friable / Brittle >1500 >500
Alumina Ceramic Hard / Tough >1500 >500
Zirconia (PSZ) Hard / Tough >1500 >800
Silicon Nitride Hard / Tough >3500 >800
Metal Matrix Composites Hard / Tough >3500 >500

Новинки продукции

Наши новейшие решения для прецизионных измерений

Последнее обновление: 2026-03-25

Посмотреть все новинки

Свяжитесь с нами

Получите информацию о продукции, коммерческое предложение или техническую поддержку

Позвоните нам +86-0553-2836939
Напишите нам mikrosize@mikrosize.com